Phys.org·3 min read·hard
Highly filled liquid epoxy for smaller, more reliable chip packaging
N
National Taiwan University
✦AI Summary
Researchers at National Taiwan University have developed a new liquid epoxy for chip packaging that balances high silica loading with processability. By optimizing particle size and adding rubber nanoparticles, the team created a material that is both durable and resistant to cracking.
edited by Sadie Harley , reviewed by Andrew Zinin
technologyscience
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