Huawei Central·3 min read·medium
Huawei plans to invest in glass substrate for AI chips by 2027
E
Emiko Matsui
✦AI Summary
Huawei plans to mass-produce advanced glass substrate materials by 2027 to enhance the performance and efficiency of its AI chips. This move is part of a broader strategy to reduce reliance on foreign semiconductor technology and circumvent restrictions on EUV lithography machines.
Huawei is constantly seeking new solutions that can contribute to its lead in China’s AI market by 2027, and according to a new report, an advanced glass substrate material could be a part of the company’s efforts to further improve the Ascend chips.
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