Supermicro Expands End-to-End DCBBS Liquid Cooling Portfolio with Rear Door Heat Exchangers for High-Density AI and HPC Infrastructure
Supermicro has expanded its liquid cooling portfolio with new Rear Door Heat Exchangers designed for high-density AI and HPC data centers. These solutions aim to improve cooling efficiency and reduce total cost of ownership for both new and legacy facilities.
SAN JOSE, Calif. , July 15, 2026 /PRNewswire/ -- Super Micro Computer, Inc . (NASDAQ: SMCI), an AI, Enterprise, Storage, and 5G/Edge IT Total Solution Provider, featuring Data Center Building Block Solutions® (DCBBS), today announced the expansion of its Rear Door Heat Exchanger (RDHx) portfolio, further strengthening its end-to-end liquid cooling solutions for high-density AI and HPC infrastructure. As a key component of DCBBS, the expanded RDHx portfolio offers flexible cooling capacities, providing data center operators with an easy-to-deploy path to liquid cooling for both new and legacy data centers.
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