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Cornell Chronicle·3 min read·hard

Too thin to fail: an alternative to copper microchip interconnects

D
David Nutt, Cornell Chronicle
Too thin to fail: an alternative to copper microchip interconnects
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Cornell researchers have identified niobium arsenide nanowires as a potential replacement for copper in microchip interconnects. Unlike copper, which becomes more resistive as it shrinks, this topological semimetal improves its conductivity at the nanoscale.

A scanning electron microscope image shows nanowires of niobium arsenide still attached to a bulk feedstock.

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